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EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
GENERAL DESCRIPTION
EM55M450/EM55Q450 series is a tiny-controller-based voice synthesizer IC which contains all the function of EM55000 series and has an MTP/QTP ROM inside.
FEATURES
EM55M450/EM55Q450 RAM (nibbles) PROGRAM ROM(bits) I/O ports D/A OSC Reset Pin * * * * * * * * * * * * 128 32K*10 204Kx 10 4 I + 12 I/O Green/Traditional DAC by option Ring or Resonator type by option Yes
Single power supply 2.4V~5.1V, suitable for 3 batteries application. Port1 and Port2 with wake-up function, Port3.2 with programmable IR (38KHz carry) communication function Power down mode for saving power consumption Single ROM for voice and program data Readable ROM code data One 6-bit timer overflow control Two stacks for subroutine calling 5-bit ASPCM /7-bit PCM voice synthesizer Multiple playing speeds in 1KHz ~22KHz for voice playback Multiple levels of volume control Traditional fixed current D/A output to drive external connected transistor for speaker or direct drive output to speaker. Package type: EM55M450 COB: COB type
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* This specification are subject to be changed without notice.
EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
EM55M450 H: dice type EM55M450 P: 40 PDIP package EM55Q450 H: dice type
PIN ASSIGNMENT
EM55M450
P2.3 1 P2.2 2 P2.1 3 P2.0 4 P1.3 5 P1.2 6 P1.1 7 P1.0 8 RESET 9 VPP 10 VSSD 11 OSCO 12 OSCI 13 NC 14 NC 15 NC 16 NC 17 NC 18 NC 19 NC 20
40 P3.0 39 P3.1 38 P3.2 37 P3.3 36 P4.0 35 P4.1 34 P4.2 33 P4.3 32 VDD 31 CIN 30 VO1 29 VSSC 28 VO 27 VCC 26 NC 25 NC 24 NC 23 NC 22 NC 21 NC
PDIP 40 PIN
* This specification are subject to be changed without notice.
4.22.2003 (V1.2)
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EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
PIN DESCRIPTIONS
Symbol P1.0 P1.1 P1.2 P1.3 P2.0/ PD0 P2.1/ PD1 P2.2/ PD2 P2.3/ PD3 P3.0/ RDYB P3.1 / WEB P3.2 / OEB P3.3/ ACLK P4.0 P4.1 P4.2 P4.3 TEST / VPP(MTP power) VDD VSSD VCC VSSC Cin OSCI / CLK OSCO RESET VO1 VO I/O I I I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I I I I I I I I O O Function Bit 0 of Port 1 Bit 1 of Port 1 Bit 2 of Port 1 Bit 3 of Port 1 Bit 0 of Port 2 / Program data pin for parallel data bit 0,4 Bit 1 of Port 2 / Program data pin for parallel data bit 1,5 Bit 2 of Port 2 / Program data pin for parallel data bit 2,6 Bit 3 of Port 2 / Program data pin for parallel data bit 3,7 Bit 0 of Port 3 / Program Ready signal Bit 1 of Port 3 / programming write enable Bit 2 of Port 3 / programming output enable Bit 3 of Port 3 / programming address increase Bit 0 of Port 4 Bit 1 of Port 4 Bit 2 of Port 4 Bit 3 of Port 4 Test / Programming power source Positive power supply Power ground Analog positive power supply Analog power ground Regulator capacitor Oscillation component pin / Program clock Oscillation component pin RESET pin (active high) Push Pull voice output Constant current output / Push Pull voice output
ABSOLUTE MAXIMUM RATING
Items Supply Voltage Input Voltage Operating Temperature Storage Temperature Symbol VDD-VSS VIN TOP TSTG Min -0.3 VGND-0.3 0.0 -25.0 Max 6.0 VDD+0.3 +70.0 +125.0 Unit V V
0 0
C C
* This specification are subject to be changed without notice.
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EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
ELECTRICAL CHARACTERISTICS (VDD=3V, 25oC unless otherwise specified)
Items Operating Voltage Standby current operating current operating current Drive current of P2,P3, P4 Sink current of P2 (before KEYB) Sink current of P2 (after KEYB) Sink current of P3,P4 Input current of P1 Output current of VO Output sink current of VO1, VO Oscillation resistor Oscillation freq. Sym. VDD IDDS IDDO IDDO IOD IOS IOS IOS IIH IVO IVO R FOSC Min 2.4 2.0 2.3 2.3 4.0 120 1.08 Typ. 3.0 1.8 3 3.0 3.0 3.5 3.5 3.0 5.0 150. 100 1.20 1.32 Max. 5.1 2 3.5 6 10.0 10.0 6 Unit V uA mA mA mA uA mA mA uA mA mA K MHz Condition no load no load, traditional D/A operate no load, Green voice D/A operate VO=2.4V VO=3V VO=0.4V VO=0.4V VO=3V VO=0.7V, traditional D/A operate Vo=Vo1=1.5 V, Green voice D/A operate osc=100 K
DC PROGRAMMING CHARACTERISTICS:
Items VDD programming voltage VDD erase voltage VPP voltage(programming process) Input current Output high voltage Output low voltage VDD supply current VPP supply current Sym. VDD VDD VPP IIN VOH VOL IDD IPP Min. 4.7 4.7 11.3 2.4 Typ. 5.0 5.0 12 2.4 Max. 5.3 5.3 12.7 7 0.4 100 50 Unit V V V uA V V mA mA Test Conditions
VDD = 5V, VIN = 0~VDD IOH = 400uA IOL = 2.1mA VDD=5V VPP=12V
* This specification are subject to be changed without notice.
4.22.2003 (V1.2)
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EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
APPLICATION CIRCUIT
VCC
VCC VDD OSCI VO1 VO
Rosc
OSCO TEST Cin
P43 P42 P41 P40 P33 P32 VSSD VSSC P31 P30 P23 P13 P12 P11 P10 P22 P21 P20
0.1 uF 0.1 uF
VCC TR1 TR5 TR9 TR13 TR17
TR2
TR6
TR10
TR14
TR18
TR3
TR7
TR11
TR15
TR19
TR4
TR8
TR12
TR16
TR20
Note :
It should add a 0.1 uF ceramic capacitor between Cin and ground. It is suggested to add a 0.1 uF ceramic capacitor between VDD and VSS.
* This specification are subject to be changed without notice.
4.22.2003 (V1.2)
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EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
PAD DIAGRAM
(0,0)
EM55M450/EM55Q450
VCC VO VSSC VO1
27 28 29 30 12 13
OSCI OSCO
CIN
31
32
33
34
35
36
37
38
39
40
1
2
3
4
5
6
7
8
9
10
11
* This specification are subject to be changed without notice.
VDD
P4.3
P4.2
P4.1
P4.0
P3.3
P3.2
P3.1
P3.0
P2.3
P2.2
P2.1
P2.0
P1.3
P1.2
P1.1
P1.0
RESET
TEST/VPP
4.22.2003 (V1.2)
VSSD
6
EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR
Pin NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Symbol P2.3 P2.2 P2.1 P2.0 P1.3 P1.2 P1.1 P1.0 RESET TEST/VPP VSSD OSCO OSCI NC NC NC NC NC NC NC
X -2.0 118.1 238.1 358.0 478.1 598.0 718.1 838.0 958.0 1101.5 1276.0 1304.0 1304.0
Y -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1013.4 -893.4
Pin NO. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Symbol NC NC NC NC NC NC VCC VO VSSC VO1 CIN VDD P4.3 P4.2 P4.1 P4.0 P3.3 P3.2 P3.1 P3.0
X
Y
-1311.0 -1311.0 -1311.0 -1311.0 -1282.7 -1082.0 -962.0 -842.0 -722.0 -602.0 -481.9 -362.0 -242.0 -122.0
-616.0 -736.0 -856.0 -976.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0
Chip size : 2920*3020 um For PCB layout, IC substrate must be connected to VSSD.
* This specification are subject to be changed without notice.
4.22.2003 (V1.2)
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